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The guidelines are based on Gore’s best practices in eWEP (extended Water Entry Pressure) testing for GORE® Portable Electronic Vents. Please follow the guidelines to conduct the eWEP testing to minimize water leakage failures caused by test issues.

To ensure that our products deliver the performance and reliability that you expect, we conduct various tests and use key performance indicators during vent production.

Finden Sie heraus, welche GORE® Protective Vents oder GORE® Performance Membranes Sie für Ihre Gassensorlösungen benötigen.

GORE® Protective Vents vs. Common Venting Solutions

As the name says, Gore Protective Vents enable pressure equalization through venting with the key feature of ingress protection. Other venting technologies have limits to protecting against the ingress of dust and moisture.

GORE® Thermal Insulation has unique properties of low thickness (< 300 μm) with conductivity less than air (< 0.02 W/(m•K) ) and therefore presents challenges in characterization. A test methodology incorporating a modified heat flow method, ex-situ thickness method, and two thickness conductivity calculation is used to provide reliable and accurate thermal conductivity data. Conductivity results show the distribution of data falls below the conductivity specification of 0.02 W/(m•K).

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As LED lighting proliferates in automotive applications, so does condensation. That’s because LED lamps’ heat source is at the rear of the assembly, making the lens area the cold spot where condensation forms most easily. Often with unpleasant results: foggy, cloudy or streaky lenses, and lamps that don’t shine as brightly as when they left the showroom. Condensation could also compromise integrated sensors or other electronic devices.

This document shows the Installation Instructions and Instructions for Use of GORE PolyVent Ex. In addition the relevant standards are listed and the attestation of conformity is described.

Rigorous testing shows how GORE® MEMS Protective Vents Style 200 reliably prevents particle contamination and pressure build-ups in MEMS microphones, and enables higher manufacturing yields and in-process acoustic testing in high-volume PCB (Printed Circuit Board) assembly operations.

This document explains why Gore performs both WEP and LEP tests to understand the physical properties of formulations in order to engineer the appropriate venting solution.